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GEMINI HQ PECVD
PECVD (GEMINI HQ PECVD 系統(tǒng)設備) 應用于淀積二氧化硅(TEOS)薄膜，氮氧化硅(SiON)薄膜，非晶硅(A-Si)薄膜等多種薄膜 - 采用等離子體增強化學氣相沉積技術生產介電薄膜，如抗反射涂層和硬掩膜介質 - 提供優(yōu)異的原子層沉積薄膜均勻性能 此外，所產生 a-Si薄膜廣泛應用于DPT / QPT硬掩膜模圖案化解決方案，適用于20nm以上的先進DRAM和邏輯器件 優(yōu)異的薄膜均勻性，高吞吐量，產能高，良好的顆?？刂萍夹g和工藝可靠性
Process
- SiON
- a-Si
- TEOS
Applications
- Anti Reflective Coating
- Hardmask Dielectric
Introduction.
GEMINI CVD system produces dielectric films with plasma-enhanced chemical vapor deposition technology such as Anti-Reflective Coating and hardmask.
Our PECVD system provides excellent ALD-like superior uniformity performance. In addition, GEMINI a-Si films are widely used in DPT/QPT hard-mask patterning solution for advanced DRAM and Logic devices beyond 20nm.
Technology.
As device scales down, uniformity is important as it can affect wafer CD variation which leads to poor device fabrication. Since dielectric films are used to form insulating features in a semiconductor device, it requires films that are exceptionally smooth as it will affect subsequent layers. GEMINI PECVD dielectric films are well-known for its extremely outstanding uniformity. Not only it has a superior productivity, but also it significantly reduces cost of ownership with very high- throughput.
Features.
- High Throughput
- Extreme Thickness Uniformity (TEOS/SiON -<0.5%)
- Excellent Tool Matching
→ User Friendly New S/W, Distribution Control System, Ether-CAT
- Process Reliability
→ TCS, Precision Moving Assembly
- Wide TEOS Process Window(Thin to Ultra High Thickness with ESC for Backside Deposition free)
